| --- Thu Feb 27 2014 | 00:00 | |
| azonenberg | Sync__: are you familiar with antenna design rules? | 23:27 |
|---|---|---|
| Sync__ | well, depends on the antenna type azonenberg | 23:35 |
| azonenberg | Sync__: As in, vulnerability of ICs to plasma damage | 23:36 |
| Sync__ | oh | 23:41 |
| Sync__ | well | 23:42 |
| azonenberg | i tried to FIB a chip after carbon coating it to reudce chargin | 23:42 |
| azonenberg | charging* | 23:42 |
| azonenberg | then strip in oxygen plasma | 23:42 |
| azonenberg | repeated the experiment a week later | 23:42 |
| azonenberg | 100% mortality rate | 23:42 |
| azonenberg | neither survived | 23:42 |
| azonenberg | i suspect the plasma clean was killing them | 23:42 |
| azonenberg | do you think a QFP leadframe + bond wires will couple enough energy from an oxygen plasma to blow out pad drivers? | 23:43 |
| Sync__ | oh, certainly | 23:43 |
| azonenberg | i was hoping that by putting the package on a grounded metal plate i'd be ok | 23:44 |
| azonenberg | but it might not have made good contact | 23:44 |
| azonenberg | So, let me rephrase the question | 23:44 |
| azonenberg | if i want to do a fib circuit edit and not charge horribly | 23:44 |
| azonenberg | what are my options? | 23:45 |
| Sync__ | good question | 23:45 |
| Sync__ | I'd try removing it from the leadframe | 23:46 |
| Sync__ | and possibly not running it through plasma | 23:46 |
| azonenberg | Well, if i remove it from the leadframe | 23:48 |
| digshadow-w1 | azonenberg: I met someone when I was up in SF with diamondman that might be interested in home CMOS stuff | 23:48 |
| azonenberg | i am gonna have a pain testing the chip | 23:48 |
| azonenberg | digshadow-w1: i need to get back to that | 23:48 |
| azonenberg | havent had the time | 23:48 |
| azonenberg | Sync__: unless we can get the wire bonder in the cleanroom working better than it is now :p | 23:48 |
| Sync__ | just rebond | 23:49 |
| Sync__ | oh | 23:49 |
| Sync__ | well | 23:49 |
| Sync__ | there is your issue :D | 23:49 |
| azonenberg | We have issues with the bonder | 23:49 |
| Sync__ | you also do not need to have it in the cleanroom | 23:49 |
| azonenberg | its in the offline test room | 23:49 |
| azonenberg | attached to the cleanroom | 23:49 |
| azonenberg | The engineer who runs the bonder made 3 bonds in a row yesterday before something malfunctioned | 23:50 |
| azonenberg | this was a new record | 23:50 |
| Sync__ | what kind of RIE method? | 23:50 |
| azonenberg | O2 plasma barrel etcher | 23:50 |
| azonenberg | they usually use it for stripping PR | 23:50 |
| Sync__ | what does it use, capacitive RF or what? | 23:50 |
| azonenberg | i think so? its a front loader with a hexagonal structure inside an outer cylinder | 23:51 |
| azonenberg | pretty sure it strikes the plasma between those two pieces | 23:51 |
| Sync__ | okay | 23:52 |
| Sync__ | try to put a magnet under the chip | 23:53 |
| Sync__ | oh wait, thinking about it that might actually make it worse | 23:53 |
| azonenberg | lol | 23:54 |
| azonenberg | i dont want more plasma bombardment | 23:55 |
| Sync__ | is it rf or dc? | 23:55 |
| azonenberg | rf | 23:55 |
| Sync__ | hmm | 23:55 |
| azonenberg | I'm thinking i need to find an alternate way of mitigating charge in the fib | 23:55 |
| azonenberg | this coating isnt the right option | 23:55 |
| Sync__ | I only ever done fib on solar cells | 23:56 |
| Sync__ | just had a quick read through some papers | 23:58 |
| Sync__ | and basically they tell, you are fucked. | 23:58 |
| --- Fri Feb 28 2014 | 00:00 | |
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