| berndj | azonenberg, auto-darkening helmets ftw indeed! | 01:32 |
|---|---|---|
| berndj | azonenberg, some pics of "alligator skin" reminiscent of your fluoride-permeable PR layers http://cool.conservation-us.org/jaic/articles/jaic39-03-005.html | 02:56 |
| azonenberg | lol | 02:58 |
| azonenberg | Looks messy | 02:58 |
| azonenberg | will check it out more in the morning, bedtime for me | 02:58 |
| azonenberg | i have a date with a SEM tomorrow morning :) | 02:58 |
| berndj | bring flowers | 03:12 |
| azonenberg | berndj: flowers? I'm bringing etched wafers :P | 11:01 |
| azonenberg | you have to know how to treat these things | 11:02 |
| azonenberg_work | berndj: remember, flowers are not high-vac compatible unless dried first :P | 12:47 |
| B0101 | hi azonenberg | 12:47 |
| azonenberg_work | hi | 12:48 |
| B0101 | a lot research is undergoing now that my lab is finally finished | 12:51 |
| B0101 | how your lithography test process? | 12:53 |
| B0101 | *hows | 12:53 |
| lekernel | http://lekernel.net/blog/2011/09/prywatna-wytwornia-lamp-where-diy-meets-vacuum-electron-devices/ | 13:26 |
| azonenberg_work | B0101. i hope you are keeping nnotes for us to see? | 18:02 |
| azonenberg_work | and i'm imaging dies on the sem now | 18:03 |
| azonenberg_work | pics coming soon | 18:03 |
| bart416 | azonenberg, couldn't you theoretically do lithography with the SEM? :P | 18:35 |
| azonenberg_work | They dont have a litho system installed on this one | 19:10 |
| azonenberg_work | uploading pics, h/o | 19:13 |
| azonenberg_work | http://colossus.cs.rpi.edu/~azonenberg/images/homecmos/2011-09-20/die_i4_009.jpg | 19:15 |
| mrdata | what magnification is that? | 19:19 |
| azonenberg_work | scale bar at bottom | 19:19 |
| bart416 | mrdata, 1000x :P | 19:19 |
| mrdata | oh yes | 19:19 |
| azonenberg_work | That's copper on silicon | 19:20 |
| azonenberg_work | here's another die with resist still on it http://colossus.cs.rpi.edu/~azonenberg/images/homecmos/2011-09-20/die_i7_005.jpg | 19:20 |
| mrdata | good job | 19:20 |
| azonenberg_work | which means ican definitely use less PR and potentially get better resolution etc | 19:20 |
| azonenberg_work | and use shorter exposures | 19:21 |
| azonenberg_work | I also have to do more work in etching silicon | 19:22 |
| azonenberg_work | metal patterning and litho at 20um scales is clearly a solved problem at this point | 19:23 |
| azonenberg_work | But before i can get a working device i need to be able to etch the Si | 19:23 |
| azonenberg_work | One thing to explore is etching of SiO2 | 19:23 |
| mrdata | yes | 19:23 |
| mrdata | HF is your friend | 19:23 |
| mrdata | but oh boy does it burn | 19:24 |
| azonenberg_work | oh, its more complicated than that | 19:24 |
| azonenberg_work | HF penetrates my photoresist :P | 19:24 |
| azonenberg_work | At least, it does when i etch Ta2O5 | 19:24 |
| azonenberg_work | SiO2 is easier to etch | 19:24 |
| mrdata | that would be a problem | 19:24 |
| azonenberg_work | i also have no way of generating SiO2 | 19:24 |
| azonenberg_work | So i might buy an oxide-coated wafer to test on | 19:24 |
| mrdata | try etching glass? | 19:25 |
| azonenberg_work | Borosilicate? Soda-lime? | 19:25 |
| mrdata | how does the chip fab industry do this? | 19:25 |
| azonenberg_work | Neither has the same characteristics of fused quartz | 19:25 |
| azonenberg_work | They normally use HF-resistant PR | 19:26 |
| azonenberg_work | or a plasma etch | 19:26 |
| azonenberg_work | Anyway so i'm thinking of picking up one of these http://www.mtixtl.com/thermaloxidewafer300nmsio2layeronsi1002diax050mmtptype1s2wksdelivery-1-1.aspx | 19:26 |
| azonenberg_work | This is <100> so i can't get vertical etches (V-trenches only) | 19:26 |
| azonenberg_work | Which means its useless for comb drive work | 19:26 |
| azonenberg_work | But i could test etching of SiO2 | 19:26 |
| azonenberg_work | The other option is to try and bum a few hours of furnace time off a lab on campus | 19:27 |
| bart416 | how precise does your temperature have to be? | 19:27 |
| azonenberg_work | bart416: Not very, not at all | 19:28 |
| azonenberg_work | But you want to be relatively uniform to avoid heat-stress cracking | 19:28 |
| bart416 | throw it in a pyrex beaker and put it on the barbecue or your kitchen oven :P | 19:28 |
| azonenberg_work | Its not that simple | 19:28 |
| azonenberg_work | I need to hit 1200C | 19:28 |
| azonenberg_work | lol | 19:28 |
| bart416 | ah, 1200C | 19:28 |
| bart416 | build a clay furnace | 19:28 |
| azonenberg_work | Could be +/- 200 | 19:28 |
| mrdata | Sale Price: USD$79.95 ??!? omg that's expensive | 19:29 |
| bart416 | If you blow into it with a hairdryer you can reach those temperatures | 19:29 |
| azonenberg_work | mrdata: thats a 4-inch wafer with a whopping 1000nm of oxide | 19:29 |
| azonenberg_work | = THICK | 19:29 |
| azonenberg_work | Anyway so thats one idea | 19:30 |
| azonenberg_work | Basically, its all boiling down to one basic problem | 19:30 |
| azonenberg_work | I have no idea how to take a pattern in photoresist and put it into something KOH-resistant | 19:30 |
| azonenberg_work | swkhan: Do you by any chance have a high-temp furnace at your lab? | 19:31 |
| azonenberg_work | And if i mailed you a wafer could you grow oxide on it and mail it back? :P | 19:31 |
| azonenberg_work | mrdata: I tried Ta2O5 patterned by liftoff, that failed because it dissolved into my resist | 19:32 |
| mrdata | read the patent literature? | 19:32 |
| bart416 | btw azonenberg you were asking about how to cast that plastic | 19:32 |
| bart416 | the guys at instructables there used something called smoothcast 300, and I looked it up | 19:32 |
| azonenberg_work | I tried Ta2O5 etched by HF through photoresist, that didnt wok beccause HF penetrated my resist | 19:32 |
| bart416 | And it's pretty much what you need to cast those turret parts | 19:32 |
| azonenberg_work | Ta2O5 etches slower than SiO2 by far | 19:32 |
| azonenberg_work | so if i use a thick photoresist layer it should survive exposureto the brief HF dose it'll take to eat a micron of thermal oxide | 19:33 |
| azonenberg_work | But SiO2 is etched by KOH slowly | 19:33 |
| azonenberg_work | It will work as a mask for shallow etches but not deep (thorugh wafer) ones | 19:33 |
| azonenberg_work | mrdata: Almost nobody does a full-wet etch process for bulk micromachining | 19:34 |
| mrdata | what do they do? | 19:34 |
| azonenberg_work | The de facto standard is to use LPCVD Si3N4 over a thin thermal oxide layer | 19:34 |
| azonenberg_work | Nitride can be etched by HF easily, even throuhg a photoresist mask | 19:35 |
| azonenberg_work | But i have no way of getting a wafer with nitride on it | 19:35 |
| Action: mrdata let's his imagination wander to nitrides; | 19:36 | |
| azonenberg_work | This whole mess with tantalumfilm was caused by me not being able to generate Si3N4 | 19:36 |
| mrdata | dont they use harsh things like HCN and NH3 to make nitrides? | 19:36 |
| azonenberg_work | No | 19:36 |
| azonenberg_work | Among other things reactive sputtering of a silicon target | 19:36 |
| azonenberg_work | in an Ar + N2 atmosphere | 19:36 |
| azonenberg_work | will deposit nitride | 19:37 |
| mrdata | oh | 19:37 |
| azonenberg_work | add a little O2 or sputter SiO2 (i forget which) and you get an oxynitride | 19:37 |
| azonenberg_work | But like i said, i dont have access to anything like that | 19:37 |
| azonenberg_work | The last idea i had was to try patterning Ta2O5 | 19:37 |
| azonenberg_work | by HF etch through a metal hardmask | 19:37 |
| azonenberg_work | I'm going to try that toniht | 19:38 |
| azonenberg_work | photoresist over Cu+Cr over Ta2O5 | 19:38 |
| azonenberg_work | expose, develop | 19:38 |
| azonenberg_work | etch metal in SC2 | 19:38 |
| azonenberg_work | then etch Ta2O5 through metal with HF | 19:38 |
| mrdata | but, the goal is to deposit lines and dots of doped semiconductor onto a substrate | 19:39 |
| azonenberg_work | No | 19:39 |
| azonenberg_work | The goal in this case is to etch a vertical pattern into a wafer | 19:40 |
| azonenberg_work | for MEMS | 19:40 |
| azonenberg_work | Doping is a much easier problem if i have a furnace | 19:40 |
| mrdata | use CO2 laser? | 19:40 |
| azonenberg_work | Spin coat doped SiO2 (Phosphosilicafilm + Borosilicafilm) onto a wafer | 19:40 |
| azonenberg_work | pattern with HF | 19:40 |
| azonenberg_work | backfill with undoped | 19:40 |
| azonenberg_work | and heat in a furnace to diffuse | 19:40 |
| azonenberg_work | I can evaporate aluminum which i'd use instead of copper since its MOS compatible | 19:41 |
| azonenberg_work | And i'd need to use an alternate developer (TMAH based, or possibly ammonia based) since NaOH / KOH kill PN junctions | 19:42 |
| azonenberg_work | Basically, if i had $2K to spare i could probably make transistors with what i have now | 19:43 |
| azonenberg_work | $1.2k for furnace, the rest for dopants | 19:43 |
| mrdata | should a furnace really cost that much? | 19:44 |
| azonenberg_work | mrdata: a nice one? Yes | 19:44 |
| azonenberg_work | http://www.mtixtl.com/compactmufflefurnace4x4x410lupto1200cwith30segmentsprogrammableandgasports.aspx | 19:44 |
| mrdata | if you made some transistors, i would like to have some | 19:45 |
| azonenberg_work | Probably going to buy some of this soon http://www.ebay.com/itm/Tetamethyl-Ammonium-Hydroxide-TMAH-30ML-FERROFLUID-/110702625718?pt=LH_DefaultDomain_0&hash=item19c66403b6 | 19:45 |
| azonenberg_work | metal ion free developer | 19:46 |
| mrdata | would a CO2 cutting laser help? | 19:46 |
| azonenberg_work | mrdata: NOt that i can think of | 19:47 |
| azonenberg_work | trace metal grade tmah woot | 19:47 |
| azonenberg_work | So i'd need that, $250 each for P and N type dopants | 19:48 |
| azonenberg_work | $250 for Silicafilm | 19:48 |
| azonenberg_work | Thats the min order (4 fl oz), if anyone wants to buy some subset of it off me feel free :P | 19:48 |
| mrdata | 4 fl oz for $250? | 19:49 |
| azonenberg_work | Yes | 19:49 |
| mrdata | seems really expensive | 19:49 |
| azonenberg_work | thats what i was quoted before | 19:49 |
| azonenberg_work | And trace metal grade chems are rarely cheap | 19:49 |
| azonenberg_work | But you dont need nearly that much | 19:49 |
| azonenberg_work | bear in mind the 4 ounces of Tantalumfilm i got, well... | 19:49 |
| azonenberg_work | i've used maybe 2 ml of 250 :p | 19:49 |
| azonenberg_work | actually no | 19:49 |
| azonenberg_work | sub 1 | 19:49 |
| azonenberg_work | So lets see - i already have PR | 19:50 |
| azonenberg_work | i can get TMAH and dopants | 19:50 |
| azonenberg_work | i'd need a furnace | 19:50 |
| azonenberg_work | i can evaporate aluminum | 19:50 |
| azonenberg_work | i can etch aluminum with HCl:H2O2 | 19:51 |
| azonenberg_work | FEOL process needs something to align dopants to, so i'd probably put a sacrificial aluminum layer down and etch alignment crosshairs into it | 19:52 |
| azonenberg_work | Then spin coat N type dopant | 19:53 |
| azonenberg_work | Spin coat PR, HF etch to pattern the N diffusion | 19:53 |
| azonenberg_work | Backfill with Silicafilm, bake to diffuse dopant | 19:54 |
| azonenberg_work | Optionally repeat the process if I'm doing P+ diffusion anywhere (assuming P type wafers) | 19:54 |
| azonenberg_work | HF to strip oxide | 19:55 |
| azonenberg_work | coat gate oxide | 19:55 |
| azonenberg_work | evaporate metal gates | 19:55 |
| azonenberg_work | spin coat PR, pattern gates | 19:55 |
| mrdata | it's a lot of steps | 19:55 |
| azonenberg_work | spin coat main dielectric layer | 19:55 |
| azonenberg_work | spin coat PR, pattern gate contacts | 19:56 |
| azonenberg_work | evaporate metal 1 | 19:56 |
| azonenberg_work | *gate and source/drain contacts | 19:56 |
| azonenberg_work | at that point i should have workin gMOS transistors | 19:56 |
| azonenberg_work | gotta go, i'm halfway across campus from my office hours that start in 5 mins | 19:56 |
| azonenberg_work | back in a few | 19:56 |
| mrdata | that's odd. the logs seem to be missing after 1940 h UTC | 20:01 |
| mrdata | past 20 minutes is unrecorded? | 20:01 |
| azonenberg_work | back | 20:07 |
| azonenberg_work | And the logs are flushed to disk every ~30 mins iirc | 20:07 |
| azonenberg_work | ask wolfspraul | 20:07 |
| azonenberg_work | he set it up | 20:07 |
| mrdata | ok, there we go | 20:12 |
| mrdata | logs agree | 20:12 |
| azonenberg_work | http://colossus.cs.rpi.edu/~azonenberg/images/homecmos/2011-09-20/overview_001.jpg | 20:27 |
| azonenberg_work | nice overview of the dies i was working on | 20:27 |
| azonenberg_work | Gotta love that insane depth of field | 20:27 |
| azonenberg_work | and here's a long shot of one of my patterns http://colossus.cs.rpi.edu/~azonenberg/images/homecmos/2011-09-20/die_i7_002.jpg | 20:28 |
| azonenberg_work | Extreme closeup http://colossus.cs.rpi.edu/~azonenberg/images/homecmos/2011-09-20/die_i7_010.jpg | 20:39 |
| berndj | mrdata, a CO2 laser is at 10.6µm, so the smallest spot you could make would be of about the same order, if you had a very fast lens. i think that's getting a bit coarse for what azonenberg_work wants to be able to do | 20:44 |
| azonenberg_work | berndj: Yeah | 20:45 |
| azonenberg_work | If i was going to do laser direct write litho i'd use UV | 20:45 |
| azonenberg_work | 385nm or so | 20:45 |
| azonenberg_work | with a ~1um spot | 20:45 |
| azonenberg_work | Thats actually on the list of methods to research | 20:45 |
| mrdata | ok | 20:46 |
| berndj | lol, got a spare excimer laser lying around? | 20:46 |
| azonenberg_work | berndj: if i had one i'd be using it already | 20:47 |
| Action: mrdata checks his pockets | 20:47 | |
| azonenberg_work | I'm thinking bluray actually | 20:47 |
| mrdata | sorry | 20:47 |
| azonenberg_work | diode laser | 20:47 |
| berndj | google "sam's laser faq" if MTI's prices are too steep | 20:47 |
| azonenberg_work | berndj: i'm aware of the site | 20:47 |
| mrdata | yeah, you can make a N2 laser ithink, from aluminum flashing and air | 20:47 |
| berndj | azonenberg_work, do you really need 1200C to grow oxide, or do you need that only if you want it to grow quickly enough that you don't do it overnight | 20:47 |
| azonenberg_work | but i doubt they can help me with my problem with MTI's prices | 20:47 |
| azonenberg_work | berndj: it's quadratic with temperature i think, up to a point | 20:48 |
| azonenberg_work | let me look up the equation | 20:48 |
| berndj | dunno... for someone as disciplined as you, you could probably pull off a DIY Ar/Kr laser | 20:48 |
| azonenberg_work | http://fabweb.ece.uiuc.edu/gt/gt/gt8.aspx | 20:48 |
| berndj | excimer would be a bit harder though :( | 20:48 |
| azonenberg_work | berndj: i dont need a lot of power | 20:48 |
| azonenberg_work | 100 mJ/cm^2 or so | 20:48 |
| azonenberg_work | is the complete exposure dose | 20:48 |
| berndj | how much coherence do you need? | 20:48 |
| azonenberg_work | bearing in mind that my die is well under that | 20:48 |
| azonenberg_work | Zero | 20:48 |
| azonenberg_work | I need a focused spot that i can aim | 20:49 |
| berndj | oh :( | 20:49 |
| azonenberg_work | that is relatively monochromatic | 20:49 |
| berndj | otherwise i was about to suggest the N2 laser | 20:49 |
| azonenberg_work | This is basically going to be a raster scan | 20:49 |
| azonenberg_work | when i say zero, i mean i dont need coherence at all | 20:49 |
| berndj | if you're willing to sacrifice some power, maybe | 20:49 |
| azonenberg_work | But it has t obe narrow | 20:49 |
| azonenberg_work | The plan is basically to raster scan the laser across the die | 20:49 |
| azonenberg_work | a ~1mm field at ~5um resolution is 200x200 pixels | 20:50 |
| azonenberg_work | blankign as necessary | 20:50 |
| azonenberg_work | just like those cheap laser projectors people mak | 20:50 |
| azonenberg_work | except the die is a lot closer | 20:50 |
| azonenberg_work | and the theta tolerance is smaller | 20:50 |
| berndj | wait, are we talking ablation or PR exposure? | 20:51 |
| azonenberg_work | berndj: PR exposure | 20:51 |
| azonenberg_work | ablation needs waaaay ore | 20:51 |
| azonenberg_work | more* | 20:51 |
| berndj | ah, hence you need <400nm lines | 20:51 |
| azonenberg_work | energy | 20:51 |
| azonenberg_work | Yes | 20:51 |
| azonenberg_work | But the spot size can be large as i am making what might be a projection mask rather than a contact one | 20:51 |
| azonenberg_work | I'm not projecting onto the di | 20:52 |
| azonenberg_work | its a mask (metalized microscope slide) | 20:52 |
| berndj | OT: i cut a section through weld beads i ran yesterday, and i'd like to etch them somehow so i can see the various zones. suggestions? I have HCl and H2O2, could that work? | 20:55 |
| berndj | (it's a crappy weld, but i want pics for my blog) | 20:55 |
| azonenberg_work | What is the material | 20:55 |
| berndj | mild steel | 20:55 |
| azonenberg_work | and whats the goal, show grain boundaries? | 20:55 |
| azonenberg_work | First step is to polish it | 20:55 |
| berndj | not necessarily even that, just to show the differences where crystals are smaller vs where they are larger | 20:56 |
| azonenberg_work | Re oxide growth rate... | 20:56 |
| berndj | polish - to what degree? i suppose having filed it flat isn't enough :) | 20:56 |
| azonenberg_work | http://www.lelandstanfordjunior.com/thermaloxide.html | 20:56 |
| azonenberg_work | berndj: optical polish is ideal :p | 20:56 |
| berndj | well, i *do* have SiC and rouge for my telescope making | 20:57 |
| berndj | lol @ your SEM micrograph showing a 5000µm scale (aka 5mm) | 20:58 |
| berndj | thinks look so alien under an SEM! | 20:58 |
| azonenberg_work | berndj: yeah | 20:58 |
| azonenberg_work | gotta love that depth of field | 20:58 |
| azonenberg_work | extreme sharpness | 20:58 |
| berndj | what did you put those chip on? it looks like... salami? | 21:00 |
| azonenberg_work | standard ted pella carbon tape lol | 21:00 |
| azonenberg_work | its pitch black under visible light | 21:00 |
| azonenberg_work | These are all <110> orientation as you can see by the edges | 21:00 |
| azonenberg_work | which are angled rather than perpendicular (i.e. parallelogram as seen from top down) | 21:01 |
| azonenberg_work | Somebody said http://colossus.cs.rpi.edu/~azonenberg/images/homecmos/2011-09-20/die_i7_002.jpg looked like a sewer grating lol | 21:02 |
| berndj | http://www.cleanroom.byu.edu/OxideTimeCalc.phtml another calculator that actually works (for me - the other one barfed when i tried it) | 21:40 |
| berndj | lol, they do look a bit like sewer gratings | 21:40 |
| berndj | ouch, a 1000nm oxide will take 9200 hours to grow at 700C | 21:41 |
| berndj | dry. wet seems faster? #todayilearned | 21:42 |
| azonenberg_work | berndj: wet is a lot faster | 21:46 |
| azonenberg_work | and yeah lol | 21:46 |
| azonenberg_work | So at room temp? | 21:46 |
| azonenberg_work | Or hot but not THAT hot? | 21:46 |
| azonenberg_work | Isnt gonna happen | 21:47 |
| berndj | yeah :( even self-cleaning ovens don't reach 700C | 21:47 |
| berndj | i think up to about 500C, but unless you leave your wafer there for a month, not very practical | 21:48 |
| azonenberg_work | lol yeah | 21:52 |
| azonenberg_work | Let me put it this way | 21:53 |
| azonenberg_work | at 1200C the wall of your oven is glowing yellow | 21:53 |
| bart416 | You'd have to build your own clay blast furnace azonenberg | 22:12 |
| azonenberg_work | bart416: or buy one | 22:14 |
| bart416 | Depends on how big your budget is | 22:14 |
| bart416 | A blast furnace isn't that hard to build | 22:14 |
| CIA-67 | homecmos r126 | wiki/Vendors.wiki | Add wafer vendor metalink. | 22:27 |
| --- Wed Sep 21 2011 | 00:00 | |
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