| azonenberg | woo | 23:24 |
|---|---|---|
| azonenberg | Finally getting around to more fab work | 23:24 |
| azonenberg | Cleaving a 2-inch double-side-polish <110> wafer into quarters, RCA cleaning them | 23:25 |
| azonenberg | then one at a time spin coating both sides of two in ~50nm Ta2O5 | 23:25 |
| azonenberg | then tomorrow evaporating Cu and Cr | 23:25 |
| azonenberg | if they pass adhesion testing in the HF tomorrow evening i will start doing some deep etch tests | 23:26 |
| azonenberg | as in 15 to >30 mins in KOH | 23:26 |
| --- Tue Aug 16 2011 | 00:00 | |
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